The Xianda Machinery XDS-055T features advanced 0.55mm ultra-thin diamond wire technology that delivers exceptional cutting precision with minimal material loss. The ultra-thin wire profile creates narrower kerf width, resulting in more slabs per block and significantly reduced stone waste compared to conventional wire saws.
Specifically engineered for high-value marble and engineered stone slab production where material yield optimization is critical. Ideal for premium stone processors, quartz countertop manufacturers, and export-oriented stone factories.
| Wire Thickness | 0.55 mm |
| Wire Diameter Range | 0.1-0.25 mm |
| Main Motor Power | 60kw |
| Total Power | 300kw |
| Cutting Speed | 0-20 m/s Adjustable |
| Processing Thickness | 5-30 mm |
| Machine Dimensions | 5000 x 3000 x 2000 mm |
| Control System | Siemens PLC with Touch Screen |
